The high-speed, low-profile LP Array™ features a dual-contact grid system with a 0.050" (1.27 mm) pitch for maximum grounding and routing flexibility. Standard lead-free solder crimp terminations allow for ease of processing. Tin-lead solder is also available. It features self-positioning pads on the PCB. Other contact counts, row counts, and gold plating options are also available for design flexibility.
The English firm BULGIN presents its new series of Waterproof connectors "6000 Series Buccaneer".
The latest addition to the well-known "Buccaneer" connector family is the 6000 Series. This series, with connections for data, signal, or power, features a "Push-Pull" locking and retention system combined with a 30° twist lock mechanism ...
