NewLPThe high-speed, low-profile LP Array™ features a dual-contact grid system with a 0.050" (1.27 mm) pitch for maximum grounding and routing flexibility. Standard lead-free solder crimp terminations allow for ease of processing. Tin-lead solder is also available. It features self-positioning pads on the PCB. Other contact counts, row counts, and gold plating options are also available for design flexibility.

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