Molex Incorporated has expanded its CPU solutions portfolio with the launch of the Intel-approved LGA 2011-0 socket for Intel Core i7 series 32nm Sandy Bridge-E microprocessors. Designed to achieve a thermal design power (TDP†) of 130W, the LGA 2011-0 replaces the LGA 1366 CPU socket, which was used with Intel's Core i7-930, i7-950, i7-960, i7-980, and i7-990X processors.
“The new LGA 2011-0 socket offers superior levels of electrical, mechanical, and thermal reliability, necessary to achieve the performance demanded by Intel’s Extreme Edition Core i7-3930K, i7-3820, and i7-3960K processors, used in high-end enterprise servers, workstations, and personal computers,” said Carol Liang, product manager for the global market at Molex. She added, “A higher pin count and contact density make the compact LGA 2011 socket an ideal solution to support the small form factor and powerful features of Intel’s most advanced second-generation Core i7 processors in applications that set new performance standards.”
An innovative full-load Interstitial Seating Plane (ISP) design improves the contact reliability of Molex's LGA 2011-0 socket by preventing short circuits caused by contact deformation due to excessive package loads. The LGA 2011-0 socket is compatible with both standard (square) and narrow ILM design assemblies. The standard ILM has a larger forbidden zone (80 mm x 80 mm) than the narrow ILM (56 mm x 94 mm). The LGA 2011-0 socket is not backward compatible with other processors or their ILM assemblies.
“The unique ISP design of the LGA 2011-0 minimizes the risk of short circuits under processor overload conditions, thus protecting the investment of users who rely on higher system reliability and uninterrupted operation,” concludes Carol Liang.
The LGA 2011-0 CPU socket uses highly durable copper alloy contacts for robust performance. The angled orientation of the socket pins reduces the risk of cross-contacts under processor overload conditions. Molex also offers sockets with 15- or 30-micron gold-plated contacts and pick-and-place caps for easy installation in automated motherboard assembly. All sockets are supplied with a JEDEC tray.
For more information, visit: www.molex.com/link/lga2011.html. To receive information about other Molex products and solutions for industry, subscribe to our email newsletter at www.molex.com/link/register/.
