which has been specially developed to meet the demanding requirements of high-density memory applications commonly found in telecommunications, networking and data systems, advanced computing platforms, industrial control equipment and medical devices.As an established DDR (Double Data Rate) DRAM interface technology, DDR3 supports data rates from 800 Mbps to 1,600 Mbps at clock frequencies of 400 MHz to 800 MHz, respectively. With a standard operating voltage of 1.5 V, DDR3 reduces power consumption by 30% compared to its predecessor, DDR2, while effectively doubling the speed.
Molex's ultra-low-profile DDR3 DIMM sockets for through-hole mounting feature a lower seating surface (1.10 mm) than standard designs and enable the use of very low-profile memory modules with seat heights of less than 2.80 mm in ATCA blade systems*. These sockets free up to 20.23 mm of vertical space above the printed circuit board (PCB) for mounting high-density DIMMs while maintaining the same design height. The new DDR3 DIMM sockets also offer a low contact resistance of just 10 mΩ, supporting the use of both registered and unregistered DIMMs and reducing power consumption in blade servers. The halogen-free sockets, equipped with a locking mechanism, are housed in a high-temperature, glass-fiber-reinforced nylon shell and feature a locking mechanism to enable both wave soldering and high-temperature infrared reflow soldering.
Designed for multiprocessor server chipsets, Molex DDR3 DIMM sockets for press-fit and SMT mounting feature an aerodynamic housing to maximize airflow, save space and costs, and reduce power consumption. The sockets are available in the following versions: ultra-low profile press-fit (14.26 mm), low profile press-fit (22.03 mm), ultra-low profile SMT (14.20 mm), and low profile SMT (21.34 mm). The ergonomic locking design allows for quick operation and easy removal of high-performance memory modules, while the low seating surface of 2.40 mm optimizes vertical space for more flexible memory module heights. By freeing up valuable PCB space for higher-density traces, the press-fit sockets feature high-precision pins that are smaller than standard press-fit terminals.
All Molex low, ultra-low, and ultra-low profile DDR3 DIMM sockets are RoHS compliant, and their through-hole and SMT versions are halogen-free.
