This new optical connectivity solution, based on GF's silicon photonics platform, enables the use of broadband and high radix to meet the growing demand for high-speed data transmission, while improving the ease of maintenance of CPO switches for expansion and scalability topologies.
This advancement begins with a photonic integrated circuit (PIC) featuring a uniquely designed etched groove, developed by GF, which provides access to wideband light input/output spot size converters (SSCs). In addition to enabling low-loss coupling, these SSCs are capable of supporting the high-power lasers required by today's co-packaged optical (CPO) solutions. Their scalability also supports the high radix counts demanded by modern systems.
The microlenses are precisely embedded in the etched grooves using active alignment. After verifying optical performance, a SENKO SEAT receptacle is bonded directly to the chip surface, establishing a mechanically robust and optically stable attachment point that enables passive and repeatable alignment throughout all subsequent stages of PIC assembly and packaging.
Thanks to the unique interlocking geometry integrated into the surface of the SEAT receptacle, any mating component with the corresponding characteristics can be precisely and passively aligned with the PIC's optical ports. The mechanism provides exceptional repeatability, interchangeability, and mechanical stability, and is fully optimized for high-volume manufacturing (HVM).
One such component is SENKO's metal PIC coupler (MPC), which attaches to the receptacle to provide precise and repeatable optical coupling to the microlens. Its detachable form factor enables optimized testing at the wafer and die levels, while also facilitating efficient integration during assembly. At the system level, the MPC serves as the critical optical interface between the PIC and the front-end in high-data-rate co-packaged optical switches (CPOs), ensuring reliable connectivity and scalability for next-generation network architectures.
“This is a game-changer,” says Kazu Takano, director of business development and president of the SENKO Emerging Technologies Group. “This collaboration lays the foundation for a new era of co-packaged optics. By enabling precise, repeatable alignment and seamless wafer-to-system integration, we are opening the door to scalable manufacturing and unlocking the performance needed for the next generation of data infrastructure.”.
“We are proud to partner with SENKO and deliver this advancement in PIC production on our proven silicon photonics platform, which provides the performance and bandwidth needed for next-generation AI data centers,” said Kevin Soukup, senior vice president of GF’s silicon photonics product line. “With this latest advancement, we have taken a step closer to realizing co-packaged optics and unlocking the next era of connectivity.”.
“This is just the beginning,” Takano added. “As AI workloads and optical interconnects converge, this advancement in alignment will serve as a critical enabler, not only driving the adoption of co-encapsulated optics but also shaping the future of global data infrastructure.”.
