With this industry-leading technology, customers have the flexibility to develop products that support multiple wireless connectivity standards using a single chip and identical RF design.
The SimpleLink ultra-low-power platform supports Bluetooth® Low Energy, ZigBee®, 6LoWPAN, Sub-1 GHz, ZigBee RF4CE™, and proprietary modes up to 5 Mbps. With this IT platform, SimpleLink expands its portfolio to become one of the broadest, lowest-power, and easiest-to-use wireless connectivity solutions in the Internet of Things (IoT) industry.
The platform is also easier to design through out-of-the-box protocol stacks, TI RTOS, the Code Composer Studio™ integrated development environment (IDE), development tools, online training, and E2E™ community support. Only minimal RF experience is required, with reference designs available to simplify development and design. Furthermore, TI makes it easier for customers to connect to the cloud through the TI IoT cloud ecosystem.
The first members of the SimpleLink ultra-low-power wireless MCU platform are the CC2640 for Bluetooth Smart, and the CC2630 for 6LoWPAN and ZigBee. For added flexibility, customers can use the CC2650 wireless MCU for multiple 2.4 GHz technologies, including Bluetooth Smart, 6LoWPAN, ZigBee, and RF4CE. Leveraging this multi-standard support, customers can future-proof their designs and configure their chosen technology at the time of field installation. Additional platform members—the sub-1 GHz CC1310 and the CC2620 ZigBee RF4CE—will be available later in 2015.
Designed for ultra-low power consumption,
the new platform, engineered for low-power operation, includes a unique integrated sensor controller that autonomously interfaces with external sensors while the rest of the device is in sleep mode. The platform features radio current peaks below 6.2mA and MCU active current of less than 61µA/MHz. The entire chip can remain in standby mode at only 1.1µA with memory retention and the RTC (real-time clock) running.
SimpleLink's ultra-low-power wireless MCU devices will be available in 4x4, 5x5, and 7x7 mm QFN packages. The 7x7 mm package is available now as part of TI's sample program; the other packages will follow in the coming months.
