The new PAN 1760 Series Bluetooth v4.1 smart modules with integrated antenna and GATT eBID profile are a low-power SoC solution for low-power Bluetooth applications such as data transfer to smartphones/tablets, wireless medical monitoring, smart homes, general industry, and portable applications without a host MCU.
The PAN1760 module is based on a single-chip Toshiba TC35667-006 Bluetooth semiconductor device. The integrated 512 KB EEPROM and 32 KB RF transceiver RAM can be used for storing and executing application code, enabling standalone operation without a host MCU. Both Central and Peripheral modes are supported and benefit from FCC, IC, and CE approvals. It features very low-power standby modes and short transition times to operating modes, resulting in minimal additional power consumption.
Expanding Panasonic's Toshiba-based Bluetooth module ecosystem, the PAN1760 series and the PAN1026 series share the same form factor and module area. Applications and profiles developed using the PAN1026 Bluetooth LE can be almost exactly transferred to the PAN1760. Only minor modifications are needed to access the PAN1760's expanded feature set.
Digi International and Digi-Key present a new XBee kit with wireless connectivity
Digi International® and Digi-Key Electronics have announced the availability of the Digi XBee® Wireless Connectivity Kit (XKB2-AT-WWC). Initially available exclusively through Digi-Key for the next 90 days,
