The connectors feature a compact rectangular form factor with multiple rows of precision-engineered pins or sockets, available in a wide variety of pin counts and configurations. The low-profile design allows for use in space-constrained applications while maintaining signal integrity and long-term reliability. Designed for surface-mount technology (SMT), Micro-D connectors are soldered directly onto the copper pads of the printed circuit board (PCB), enabling efficient assembly and robust electrical performance.
Other technical details include robust electrical performance, with a specified contact resistance of 8 milliohms maximum for the contact interface, plus any additional resistance of the solid conductors depending on the wire gauge, measured at 2.5 A. The devices support a current rating of up to 3 A and provide a dielectric voltage of 600 VAC at sea level and 150 VAC at 70,000 feet, with leakage current limited to 1 mA. Insulation resistance is rated at a minimum of 5000 megohms at 500 VDC, ensuring reliable operation in demanding environments.
