The Molex zCD interconnect system connector, now available from Mouser Electronics, enables 4.4 TBps with 11 modules across the product range, supporting the next generation of 400 Gigabit Ethernet. As part of the Molex zCD interconnect system, this small connector accepts both passive and active copper cables. The compact form factor is built in a straight format with a 0.75 mm pitch. This small pitch eliminates lateral footprint offset, and the overall connector design provides high port density with close placement along the panel.
The Molex zCD interconnect system connector features an elastomeric gasket for superior electromagnetic interference (EMI) containment and suppression, a push-in design for robust and easy board termination, and excellent thermal management that accommodates a wide range of customer-spec thermal modules and heat sinks. The connector is ideal for a wide variety of Ethernet-based applications, including telecommunications devices, core switches, routers, data centers, enterprise computing devices, top-of-rack (TOR) switches, and any other Ethernet application requiring 400 Gbps interfaces.
