Molex's new circuits and assemblies minimize impedance discontinuities in high-speed military and aerospace data and telecommunications devices, and are characterized by being lightweight, portable, and suitable for use in harsh environments.
Designed for a wide range of applications, from handheld devices to large storage systems and computers, Molex rigid-flex circuits and assemblies combine the advantages of flexible copper circuitry and rigid printed circuit boards (PCBs) into a single power and signal solution, delivering excellent reliability and a reduced total cost of ownership. Hybrid constructions consist of rigid and flexible substrates laminated together in a single structure, integrating the characteristics of a PCB with the advantages of flexible PCB technology.
By accommodating larger connection housings and multiple surface-mount electronic components, flexible circuitry allows the assembly to be bent or folded within a three-dimensional package space, resulting in an optimized end product. Molex flexible circuitry can be built with 20 or more layers, according to specific design requirements. Each rigid-flex circuit is designed to suit the customer's unique application and can be surface-mounted on one or both sides, increasing overall circuit density and providing additional packaging options. Loose layers offer maximum flexibility in space-constrained applications. The flexible substrate integrates power and signal technologies into a single package to reduce weight and optimize the packaging of military devices.
Molex flexible circuits and assemblies are available in a variety of stacked designs and materials to meet the demanding requirements of military applications. Rigid-flex circuit assemblies can be press-fit, surface-mount, or wave-soldered and utilize virtually the entire spectrum of Molex connectors, including but not limited to Impact™, NeoScale™, and SlimStack™.
