Optoscribe's 3D glass integrated photonic circuits combine integrated waveguides and high-precision micromachining for applications ranging from data center optical transceiver interconnects to fiber optic connectivity and consumer electronics.
This strategic cooperation will flood the market with practical use cases for Sumitomo Electric's MCF interconnects. This is especially true for four-core (or higher) MCFs with blown input/output components based on glass-based 3D photonic technology in data communication applications where ultra-high-density optical interconnection is required.
Nick Psaila, CEO of Optoscribe, states: "We are delighted to embark on this strategic cooperation with Sumitomo Electric. We see this as a great opportunity to jointly address the performance challenges facing telecom and data applications, while creating and fostering the supply chain for further deployment of multicore fiber and related technologies."
Tatsuo Saitoh, Director of the Optical Communication Laboratory at Sumitomo Electric, commented: “We believe that both companies, with their cutting-edge technologies, can create a new market and ecosystem for multi-core fiber-based interconnects. We are excited that our products will solve customers' challenges for ultra-high-density optical interconnects.”
