The new models are designed to fit existing or new data center environments, with options including rack-based and row-based configurations, as well as liquid-to-air and liquid-to-liquid technologies. These innovative systems offer a flexible and scalable approach to addressing growing capacity demands while accelerating the adoption of liquid cooling.
The Vertiv CoolChip CDU family is part of Vertiv’s extensive liquid cooling offering and its comprehensive Vertiv™ 360AI power, cooling, and services portfolio, designed to address the complex challenges of AI deployment. Backed by Vertiv™ Liquid Cooling Services, a global offering of comprehensive liquid cooling services that includes design, installation, commissioning, fluid management, and maintenance, the liquid cooling portfolio supports a wide range of deployment scenarios, from retrofitting existing facilities to scaling high-density AI and HPC clusters in new builds.
The Vertiv™ CoolChip CDU 70 is a row-based liquid-to-air refrigerant distribution unit that provides quick and affordable access to liquid cooling for data centers repurposing existing environments or deploying new infrastructure. Designed to utilize existing thermal infrastructure, this liquid-to-air CDU is ideal for facilities looking to deploy liquid cooling capacity without significant infrastructure changes. The system delivers up to 70 kW of cooling capacity and is engineered for agility and scalability, helping to reduce secondary fluid network complexity and infrastructure footprint. The integrated controller enables real-time monitoring, group control, and direct unit-to-unit communication to coordinate thermal performance, simplify management, and facilitate efficient scaling across multiple racks.
The Vertiv™ CoolChip CDU 100 delivers powerful in-rack liquid-to-liquid cooling performance, providing data centers with a secure, space-saving solution for high-density workloads. It's ideal for operators to introduce or expand rack-by-rack liquid cooling deployments, facilitating incremental growth or AI pilot programs without requiring large-scale infrastructure changes. With 100 kW of cooling capacity in a 4U form factor and a large-surface-area heat exchanger designed for low temperatures, the Vertiv CoolChip CDU 100 facilitates optimal heat transfer. The integrated controller provides monitoring and control capabilities to accelerate operations and improve visibility. Integrated filtration and precise temperature control to ±1°C help maintain fluid quality and thermal stability, while physical separation of the circuits for the installation and IT systems contributes to safe and efficient system management in operationally critical environments.
The Vertiv™ CoolChip CDU 600 is a liquid-to-liquid in-row model that provides robust and scalable liquid cooling capacity for high-density AI and HPC deployments. The 600 kW system is designed to meet the demands of hyperscale and colocation environments, supporting in-row configurations and seamlessly integrating into raised floor or retrofit installations. Its design includes top- or bottom-pipe connections and internal manifolds to accelerate infrastructure planning and deployment. With redundant pumps, advanced temperature and fluid quality monitoring, and a flexible deployment approach, the Vertiv CoolChip CDU 600 delivers reliability, visibility, and performance to customers looking to scale liquid cooling in large-scale computing environments.
