Thanks to its unique and market-first approach to device connectivity, Sigfox's solution is far simpler than traditional tools, including other LPWA connectivity offerings, as it enables device connectivity without the need to establish and maintain network connections. The deployment of a global antenna network allows Sigfox to listen to and respond to signals sent by IoT devices worldwide, using minimal power—to the point that batteries may one day become unnecessary.
The significant simplification of module requirements also allows manufacturers compatible with the Sigfox module to reduce the silicon footprint to the bare minimum, enabling unparalleled, extremely cost-effective, and simple solutions.
The new ultra-low-cost IoT modules significantly reduce the cost barrier, with modules up to 20 times cheaper than LTE cellular modules and 5 times cheaper than the technologies of the closest competitors. The LPWA solutions market is expected to grow by 90% annually to reach $24.5 billion by 2021, so today’s announcement will further accelerate growth and access to this market.
To achieve these unprecedentedly low costs, Sigfox worked with its partners to optimize every aspect of the design and specifications down to the silicon level. The module specifications are also royalty-free to ensure the lowest possible cost, while simultaneously fostering even greater levels of innovation.
“As the costs of connecting devices to the IoT fall, the cost of modules becomes a key factor in the equation,” explains David Parker, senior research analyst at Beecham Research. “This announcement reinforces Sigfox’s IoT service provider approach to the market, reducing the cost of connectivity, enabling more applications to connect cost-effectively, and expanding the market.”
The first partners supplying the ultra-low-cost modules include module manufacturer Wisol, which is already delivering samples based on the ON Semiconductor single-chip SoC transceivers and will begin mass production in December 2016. In addition, InnoComm will manufacture modules based on the NXP transceivers. Samples will be available starting in January 2017, with mass production slated to begin in March 2017.
Sigfox's network spans 24 countries and is on track to exceed 60 by 2018. Sigfox has built a comprehensive supply chain of ecosystem partners who are developing, selling, and supporting connected devices. These partners include semiconductor manufacturers, programmers, design studios, module manufacturers, original design/electronic manufacturing services providers, device manufacturers, and distributors.
Sigfox is also working with its partners to enable new modules to integrate its protocol with other connectivity protocols, such as Wi-Fi and Bluetooth Low Energy (BLE). Combining these protocols with Sigfox will provide additional benefits such as data backup and improved security and energy efficiency. These additional low-cost modules will be available in early 2017.
Stuart Lodge, Executive Vice President, International Sales and Partners at Sigfox, commented: “This announcement reflects the strength of our partner ecosystem, which enables us to offer low-cost devices and accelerates the mass production of compatible Sigfox modules and devices.
We believe in a future where billions of connected devices will play a role in our economic and social development. The dramatic reduction in the cost of low-power devices means we are positioned to make this happen much faster.
Sigfox remains focused on lowering the barriers to mass IoT adoption by working with the entire ecosystem, including all our device and silicon partners. We will continue to expand and support our partners to overcome cost challenges and bring to life the new solutions the market needs.”
Volker Graeger, Vice President of Secure Vehicle Access at NXP, explains: “We are delighted to be part of the Sigfox ecosystem and its evolving approach to device connectivity. These IoT modules will be catalysts for new business models and use cases that are virtually unimaginable today.”
Dr. Thomas Wolff, Vice President at ON Semiconductor, states: “Sigfox and its partner ecosystem have lowered the barriers to a future IoT thanks to a high level of integration and a reduced BOM, all without compromising performance. By significantly extending battery life and device lifespan, we can envision a future where battery life is no longer a limiting factor.”
JiHo Kim, CEO of Wisol, commented, “As an international partner of Sigfox in module manufacturing, we are excited about the launch of the competitive module solution, ideal for expanding IoT opportunities to unprecedented levels. We are confident that our module solutions will play a vital role in enabling device manufacturers to build IoT solutions quickly and easily. We will continue to strengthen our partnership with Sigfox to expand the global Sigfox network and ecosystem.”
Paul Wang, CEO of InnoComm, stated, “The simplicity of the new specification makes building modules on the Sigfox network incredibly easy. It essentially allows for a seamless transition from proof of concept to mass production and high-volume manufacturing. This is essential for fostering mass adoption, particularly among product manufacturers looking to become service providers.”
