The company has developed numerous products for all types of applications. In this fast-moving market, requirements are constantly changing. One of the trends in this market is the miniaturization of components.
The demand for small interconnect components is increasing, which has led PRECI-DIP to develop innovative solutions and redesign the concept of our contacts and connectors.
PRECI-DIP has introduced a new series of ultra-low-profile spring-loaded contacts for applications where board space is limited. Three new types of spring-loaded contacts have been designed for board-to-board connections.
The first spring-loaded contact, 2.55 mm high, is mounted on the board. This is a traditional mounting method. A second contact is mounted through the board, but like the first SLC, it is soldered to the top of the board. Its height above the board is only 1.55 mm. Finally, the third SLC is pushed into the board from the rear and also soldered to the back of the board. Its height above the board is only 1.25 mm.
The three low-profile spring-loaded contacts have a travel distance of 0.6 mm. They are rated for 1 A continuous and 2 A peak current (typical values, depending on the application and environment). They offer the same performance level as any other high-quality PRECI-DIP spring-loaded contact.
These spring-loaded contacts are supplied in bulk with standard encapsulation. Contacts mounted in an insulator (plastic or FR4 epoxy) can be developed according to customer requirements.
