Alcatel-Lucent has strengthened its collaboration with the Deutsche Telekom Group (DTAG) by signing a new series of optical transport contracts with four of its subsidiaries located in Austria, the Czech Republic, Poland, and Slovakia. By facilitating a seamless network transformation, Alcatel-Lucent's optical transport solution will enable these subsidiaries to meet the increased bandwidth requirements for efficiently delivering fixed and mobile broadband data services, including mobile internet, video and multimedia services, high-speed internet access, and triple-play services.

HP recently launched the new HP Extreme Scale-Out (ExSO) portfolio, designed to offer companies involved in high-performance computing, Web 2.0, and cloud computing a new level of cost and resource savings.

The headquarters of GAIA-Cluster TEIC in San Sebastián hosted the official presentation of the report on September 16: “The historical origins of the Electronics, Computing and Telecommunications Cluster in the Basque Country and its legacy for the present”

MRV's Terescope® 10GE is the first wireless link on the market to offer 10 Gigabit Ethernet connectivity.
This device sets a new benchmark for wireless transmission speeds, providing a last-mile solution in areas where fiber optic infrastructure is unavailable or impractical, and where the performance of fiber optics is needed along with significant cost savings.

HP announces its collaboration with Verizon Business, a division of Verizon Communications, to launch the new Computing as a Service (CaaS) solution that offers companies a flexible, secure and cost-effective mechanism to manage their IT resources.

Alcatel-Lucent and TIM, one of Brazil's largest mobile operators, have deployed an innovative packet transport solution for the metropolitan environment, the first of its kind in Brazil, which will allow reliable, secure and economical transport of current 3G traffic and provide TIM with the possibility of a gradual transition to LTE (Long Term Evolution) to meet market demands when necessary.

Voice over Internet Protocol (VoIP) is becoming increasingly popular as a low-cost alternative for users making long-distance and international phone calls. However, for users accustomed to the high audio quality offered by the Public Switched Telephone Network (PSTN), VoIP quality generally falls short in comparison.

Molex Incorporated has received certification that its iPass+™ HD system meets the proposed Serial Attached SCSI (SAS) 2.1 standard. Molex's high-density internal and external connector inputs and outputs provide the same port density for low-profile PCI Express® cards as Molex's current iPass+ solution for standard-height cards.

A manufacturing process that allows cables to be insulated with PTFE over polished copper without oxidation. This is the latest innovation for all applications subjected to temperatures exceeding 200°C. This new process allows PTFE insulation to be extruded onto a polished copper conductor without degrading the conductor's surface. This prevents oxidation and, consequently, preserves the copper's properties necessary to ensure a reliable connection.