Technological trends in the industrial and consumer sectors are very diverse. Miniaturization is a key factor: increasingly smaller chips with higher levels of miniaturization make it possible to create ever more compact device designs.

Samtec introduces a one-piece, high-density interface with integrated Plastronics H-Pin® spring contacts, designed with excellent electrical, mechanical, and thermal characteristics. Compared to other spring contact solutions, this interface is a cost-effective and space-saving alternative that doesn't compromise on high-speed performance and maintains a reliable connection.

Molex Incorporated Impact™ 100W Orthogonal Direct Connect System is designed to establish a direct PCB connection using the same auxiliary board. With 3-step and 6-pair options, Impact Orthogonal Direct Connect technology supports data rates of up to 25 Gbps and greatly reduces airflow, crosstalk, and capacitance restrictions in high-speed channels, which can be introduced through existing backplane/midplane boards.

Expanding its RF capabilities and building upon its renowned customer service, Samtec presents its new RF interconnect catalog. The product selection in the new catalog includes everything from standard RF applications to high-density solutions and custom challenges. Samtec offers free samples and quotes within 24 hours, with no minimum order quantities and an incredibly fast 2-3 day lead time for standard products.

Farnell has added three new LED lighting connector designs to its JAE interconnect product range. The agreement between the two companies, which includes a six-month exclusivity period, makes Farnell the first European distributor of the ES3 series.

Samtec, Inc. will participate in the DesignCon 2012 conference and exhibition (Santa Clara, California, USA, January 30–February 2, 2012) with SI Fusion, end-to-end interconnect solutions that make the entire system faster, thinner, and lighter over longer distances, with lower overall costs. Samtec will also present a 40-minute technical brief on enhanced signal integrity model validation connection techniques.

Harwin adds a new female board contact to its EZ-BoardWare range of surface mount technology products, enabling considerable cost savings.

The Suyin 020200MA005XX56XX series is a new 5-pin surface-mount Mini USB Type-B female connector specifically designed for consumer products. However, its robust construction also makes it well-suited for industrial automation applications.

Samtec continues to evolve its SEARAY™ interconnect line to support the demands of high-speed applications requiring high reliability, high pin count solutions.

ERNI Electronics enables reliable printed circuit board connections in extremely miniaturized applications such as lamps or LED systems.

Harwin announces that its range of M52 2.54 x 1.27 mm pin strips, part of its Archer board-to-board connector system, is now available from stock, rather than being produced to order based on customer-specified pin heights. Available in both traditional push-in and surface-mount styles, these pin strips can be supplied immediately as standard in a wide range of pin lengths, increasing design flexibility.

ERNI Electronics introduces a new family of 0.8 mm pitch dual-row connectors for surface mount technology (SMT) under the MicroCon brand. These miniature printed circuit board connectors are ideal for a variety of demanding applications in industry, medical, lighting, automotive, and consumer electronics.

TE Connectivity (TE) , formerly Tyco Electronics, has developed a new type of single-row Economy Power (EP) connector called EP 2.5. This crimp connector system incorporates new housings, contacts, and heads based on a 0.100” centerline (2.5 mm pitch), resulting in a very compact solution.

TE Connectivity (TE) , formerly Tyco Electronics, introduces a new generation of Economy Power (EP) single-row connectors. The new EP II interconnect system features new housings, a new curl contact (terminal) design, and dedicated post heads.

Samtec offers a complete line of high-speed motherboard edge sockets in a variety of pitches and orientations to support numerous application needs. Solutions include designs for standard high-speed, micro-pitch, Serial ATA, and PCI Express® applications, as well as designs optimized for high signal integrity performance.

TE Connectivity (TE) , formerly Tyco Electronics, introduces its next generation of SL-156 wire-to-board crimp connectors with a terminal position assurance (TPA) device. The new housing design expands the existing SL-156 family and is fully compatible with SL-156 and MTA-156 board headers.

Samtec has expanded its family of discreet cables to include a discreet Tiger Eye™ assembled cable with a 2mm pitch and high mechanical strength.

Global Connector Technology (GCT) offers a new range of mUSB connectors, now defined as the standard interface port for Smartphones in Europe.

Molex Incorporated introduces its ClipLok™ interconnect system, an electromechanical connector that easily clips on to securely attach a membrane keyboard or FPC end to a printed circuit board, without the need for mating connectors at each point.

Souriau 's HD (high density) range , which follows the AerioMil MIL-DTL-38999 and VG96912 standards, is based on a standard design and has been specially developed to withstand the most adverse working environments (shocks, vibrations, high temperatures, etc.).